Intel might be the key to re-realizing the American dream of advanced chip production and packaging on U.S. soil. Under the Trump administration, the United States has been making significant efforts to establish leading-edge chip manufacturing domestically. Achieving this goal is challenging for several reasons. In the race for the most advanced silicon, only a few major veteran players remain: Intel, Samsung, and TSMC. Among these, Taiwan-based TSMC has consistently overcome obstacles to become the leader in the semiconductor industry. Through a strategic approach to semiconductor development, TSMC has excelled in both leading-edge node production and advanced chip packaging, enhancing performance.